International students pursuing undergraduate degrees at Singapore Management University are fully funded by the scholarship. This opportunity is currently accepting applications.
The Dato’ Kho Hui Meng Scholarship was established in 2019 and is offered to full-time first-year undergraduates at Singapore Management University pursuing any degree program. The scholarship program seeks to develop students into creative, responsible, and globally-minded undergraduates as well as future leaders who are dedicated to changing business and society for the better.
The fully funded Singapore Management University Scholarship provides $87,600 for study-related costs, tuition, and supplies for programs for international students that have been authorised by the university.
We will go over the prerequisites for the scholarship in depth and offer a step-by-step application process in this post.
Host Country: Singapore
Opportunity Type: Undergraduate Scholarships
Eligible Countries: All Countries
Financial coverage: Full Scholarship | $87,000 Stipends/Yr
Eligibility Criteria:
- Enrol in any degree program as a full-time first-year student.
- Accepting applications from candidates of any nationality, although Singaporeans, Malaysians, and Singapore Permanent Residents will be given preference.
- At the time of admission, attain exceptional academic ranking.
- Show that you have great interpersonal skills and leadership abilities.
- Play sports and volunteer in the community on a regular basis.
- Continue to have a CGPA of 3.6 or higher after the second year.
Benefits:
- The maximum amount of the scholarship is $87,600, which covers study-related costs, reduced tuition, and funding for programs for international students that have been approved by the university.
- given for a maximum of four years, provided the winner continues to meet the requirements for eligibility and the terms of the award.
- If they fulfil the specified requirements, eligible Singaporean grantees may also be eligible to receive a bursary for cash allowance concurrently.
Deadline: July 31, 2024
